IndexProductsPC CASEBK-Series
  
 
BK623
 
Color
Downloads
 
Installation Manual
DM
 
 
Case Size
S.F.F Tiny Tower Chassis
Processor
Support Dual Core and Quad Core Processor
Material
0.6mm SECC Japanese ECO Steel
External Drive Bay
5.25" x 1, 3.5" x1
Internal Drive Bay
3.5" x 1
Front Ports
USB 2.0 x 4, HD Audio x 1
Dimension (H x W x D)
w/o Front Panel
323 x 140 x 276 mm
12.7" x 5.5" x 10.8" (12.5L)
M/B Form Factor
Micro ATX
Power Supply
SFX 12V form factor, 300W
I/O Expansion Slots
Full Height Slots x 4
Thermal Solution
Intel Mt. Jade Ref. Design
New Partition Plate Cooling Tech (New PPCT)
No Second Fan (Rear Fan) Needed
Safety
Meets RoHS, CE and FCC Class B Requirements
Security
Padlock Loop / Kensington Slot
Optional
IEEE 1394 / IR / Removable Air Filter
Chassis Intrusion Switch
Screwless ODD/FDD/HDD Bays Clips
Screwless Top Cover Clips
 
* The actual product is subject to change without prior notice. In Win Development Inc. reserves the right to make final modifications.
 
 
Small Case Smart Choice +

With easy to integrate, flexible design, excellent performances, and advanced Technology, BK Series provides a perfect avenue to boost your margins and increase revenue.
Easy
Compatible with all standard for desktop components. Easy system integration.
Flexible
Small but flexible enough to accommodate four full height PCI cards.
Excellent

Meets 65W 2006 FMB thermal target for Core™ 2 Duo without any case fan. Meets 30 dB(A) or 3.5 BA of system acoustic target in idle mode (Lower processor power, C1E enabled & iQST implemented for Conroe on 965/ICH8 platform).


Design Philosophy
To design a small 13L SFF chassis with better thermal & acoustic performance than other bigger size chassis.
Security +

Padlock loop
Kensington Slot
Optional +

IEEE 1394
IR
Removable Air Filter
Chassis Intrusion Switch
Screwless ODD/FDD/HDD Bays Clips
Screwless Top Cover Clips
Excellent Thermal Solutions +

Intel Mt. Jade Ref. Design
New Partition Plate Cooling Tech (New PPCT)
No 2nd Fan (Rear Fan) Needed
Additional ventilation holes on the side panel
 
Features +

3rd Generation of Partition Plate Cooling Technology (PPCT)
  + PPCT is the world's first advanced thermal and acoustic cooling technology, which provides S.F.F. chassis with excellent thermal solutions while creating a quieter computing experience.
The 3rd generation of PPCT includes an adjustable air duct for various CPU fans and efficiently eliminates overheat while enhances airflow of entire system. .
 
  + No second fan needed.  
  + Support LGA1156 Socket and downward compatible (LGA775)  
Adjustable Partition Plate Cooling Tech accommodates different motherboards and provides the optimal thermal performance.
Detachable 5.25” optical drive bracket for easy installation.
Standard SFX 12V 250W & 300W power supply platform offers high performance / low power solution.
USB 2.0 x 4, HD Audio x 1, IEEE 1394 (Option)
Designed to fit standard Micro ATX motherboards for easy system integration.
Designed for Digital Home and Digital Office. Supports 4*full height slots for GFX / TV tuner cards.
Optional removable air filter.
Optional screwless designs-ODD/FDD/HDD bays and top cover clips for easy installation.
Meets RoHS, CE and FCC Class B requirements
Tool Free +

Screwless ODD Bays Clips
 

Screwless FDD Bays Clips
 
Screwless HDD Bays Clips
 
Screwless Top Cover Clips
 
 

 
 
3rd Generation of Partition Plate Cooling Technology (PPCT) +
 
Enlarged Vent

Removable Air Duct

 
Adjustable Positions
*The New PPCT Technology supports LGA1156 Socket and downward compatible(LGA775).

System Thermal Result +
 
Cooler Fan Speed 2684 RPM
Gfxcard with Active Fansink
CPU
Core™ 2 Duo E6700 (2.66GHz)
Ambient Temperature
35℃
Tcase of CPU
57.22
Ta average
37.16
PSU out
52.19
ICH8 TOP
47.77
MCH
46.49
DIMM
43.79
HDD
49.24
SYSTEM IN
35.00
VGA
46.68
Tcase projected to 65W TDP
58.61
Margin to 60.1C Spec
1.49

Source from Mt. Jade Ref. Design, co-work by In Win and Intel. All examine source are subject to change in anytime, without notice.
Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of IN WIN products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance.
 
 
Q&A +
 
Heatsink Solution for BK623(Mt Jade) chassis
Q. How to select a proper heatsink for Mt. Jade / BK623?
A.
(1)Use Intel boxed heatsink
or
(2)Select a Radial-fin heatsink (similar to the boxed fan heatsink solution from Intel).Here is a list of 3rd Party thermal solutions per processor from Intel’s website:
‧Intel® Core™2 3rd party Thermal list:  www.intel.com/go/thermal_Core2Quad
‧Intel Core2 Duo 3rd party Thermal list:  www.intel.com/go/thermal_Core2Duo
‧Intel Pentium D 3rd party Thermal list:  www.intel.com/go/thermal_PentiumD
‧Intel Pentium 4 3rd party Thermal list:  www.intel.com/go/thermal_Pentium4

 
Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.

Partition Plate Cooling Tech +

 

 
 
   
 
 
The innovative partition plate cooling technology (PPCT) is the world’s first complete thermal solution co-designed by IN Win and Intel.
By separating the CPU fan from the heatsink to reduce back draft, PPCT efficiently streamlines the airflow in a unilateral direction to provide exceptional thermal performance.
Partition Plate to Guide Air Flow +
 
Before:Airflow circulates in chassis without partition plate.

After:Controlled airflow enhances thermal/acoustic experience.
 
This product is recommended to use with Intel boxed CPU cooler.
Better Acoustic Performance
System Acoustic <30 dB(A) and 3.5 BA
Lower Power – 50% lower TDP
All sound power data listed is “Measured LwA” data according to ISO 7779 standard at room temperature of 23°C ±2°C

System Acoustic Result +


 

Sound Power:
Maxpower 85% : 4.2 BA
Idle : 3.5 BA
Sound Pressure:
Maxpower 85% : 35 dB (A)
Idle : 30 dB (A)
 
 

 
07/11/05 +
I found the case to be easy to build, with solid construction throughout. While certainly not very expandable, it should be a decent performer for a multimedia PC or HTPC.
07/10/08 +
After looking at length at all three enclosures I can say up front that they all offer features that are both innovative and effective.
07/08/17 +
This ultra-compact case has a lot going for it: It doesn't cost much, it fits almost anywhere, and it runs quietly. If you're looking to put together an inexpensive entertainment PC—and intend to go the Intel route—the Mt. Jade BK623 is a great place to start building.
07/08/15 +
The Mt. Jade does a great job at balancing size, cooling, noise, and aesthetics. Enthusiasts planning to build a new Core 2 Duo/Quad Home Theater PC will find the Mt. Jade to be the perfect case for the project.
07/08/15 +
The BK623 Mt. Jade is by far the smallest case I have ever used. The case is comprised of numerous parts made of thin 0.6mm steel, which when assembled together make for a sturdy light case. The quality of all the formed parts made reassembly of the case easy, almost a pleasure.
07/08/15 +
The Mountain Jade is well-suited for an HTPC, promising only 30 dB(A) outside the case when combined with a stock Core 2 Duo cooler.
07/08/09 +
Considering the unique design, cooling performance, low noise operation, and competitive pricing, I award the In Win BK623 Mt. Jade mATX Case with 300W Power Supply the awards of "Recommended" and "Great Idea".
07/07/05 +
Looking at the numbers you can see that the In Win and Intel design Partition Plate makes a huge difference when it comes to temperatures. If you're in the market for new m-ATX case and one that will keep things nice and cool and before I forget the sound difference when compared to a normal case is astounding, you are now barely able to hear the stock Intel fan as it spins.