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A small 11.5L SFF chassis with optimal thermal and acoustic performance without additional system fan.
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Excellent Thermal Solution |
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The innovative partition plate cooling technology (PPCT) maximizes performance while providing a quiet and cooling environment.
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It is compatible with standard desktop components, which makes the installation easier and provides a great expandability when needed. |
Multi-Enjoyment |
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Designated Infrared Receiver position to support Media Center and optional Internal amplifier. |
New PPCT Excellent Thermal & Acoustic Solution
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New features of the 2nd generation of PPCT technology include removable air duct and an enlarged adjustable vent for various CPU positions. |
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Support LGA1156 Socket and downward compatible (LGA775)
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Small Form Factor Design |
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Optimal thermal and acoustic performance without additional system fan |
Detachable Drive Cage |
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For easy installation |
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Optional screwless designs-ODD/FDD/HDD bays, expansion slots, and top cover clips for easy installation
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Folded Edges |
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Standard USB 2.0 x 4 & HD Audio
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CPU Ambient Average Temperature 36.6℃(98℉)
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CPU |
Core™ 2 Duo E8400 (3.0GHz) |
Ambience Temperature |
35℃(95℉) |
Ta Average |
36.6℃(98℉) |
PSU out |
37.5℃(99℉) |
Host Bridge |
64.7℃(148℉) |
RAM |
55.6℃(132℉) |
HDD |
49.6℃(121℉) |
ODD |
48.9℃(120℉) |
FDD |
47.4℃(117℉) |
VGA |
56.2℃(133℉) |
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Lab Test: Intel Box CPU(Intel Core™ 2 Duo E8400 / 3.0GHz, LGA
775, 65W). |
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Source from In Win lab. All examined sources are subject to change at anytime, without prior notice. |
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Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of In Win products as measured by those tests. Any difference in system hardware, software design, or configuration may affect actual performance. |
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Partition Plate to Guide Air FlowT + |
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System Acoustic ResultT + |
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System Run |
New PPCT
(With half-moon shaped air duct) |
Idle |
28.6 dB |
Max Power
(CPU 100%) |
33.9dB |
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